Responsibilities:
• Develops strong technical expertise through structured knowledge transfer across on-site support, Product Line, and R&D teams.
• Designs and executes DOE (Design of Experiments), conducts trials, and gathers process data.
• Supports the setup and demonstration of Thermal Compression (TC) products.
• Participates in R&D activities including product definition, software testing, and customer validation.
• Understands various TC bonding methods (e.g., C2S, C2W, with/without flux).
• Contributes to SOP development, technical documentation, operating manuals, and Best-Known Methods (BKM).
• Conducts product evaluations, demonstrations, and creates reports and user instructions.
• Investigates and resolves on-site challenges, coordinating with Engineering for timely solutions.
Requirements:
• Bachelor’s or Master’s degree in Mechanical, Electrical, Electronics, or Mechatronics Engineering.
• At least 5 years of experience in a technically complex environment, with a minimum of 3 years in product support and R&D-related functions.
• Prior exposure to die attach or die bonding processes in a production setting is a valuable asset.
• Practical experience with semiconductor front-end or back-end processes and related equipment.
• Proficient in MS Office and AutoCAD; familiarity with MATLAB and JMP for statistical analysis is advantageous.
• Willing to travel up to 25% of the time.
• Highly assertive, adaptable, and capable of working in a dynamic environment.
Interested candidates who wish to apply for the advertised position, please click on the APPLY button below to send in your resume or send to engg1@talenttradersg.com
EA License No: 13C6305
Reg. No.: R1985234 (GOH HOOI MING)
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